TY  - BOOK
AU  - Pecht, Michael.(Editor)
TI  - Soldering processes and equipment
SN  - 047159167X (alk. paper)
AV  - TK7870.15 .So4 1993
U1  - 621.381/046 20
PY  - 1993///
CY  - New York
PB  - Wiley
KW  - Electronic packaging
KW  - Materials
KW  - Solder and soldering
KW  - Surface mount technology
N1  - "A Wiley-Interscience publication."; Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/description/wiley032/92033770.html
UR  - http://www.loc.gov/catdir/toc/onix02/92033770.html
ER  -