Pecht, Michael.(Editor) <br/><br/>
Soldering processes and equipment / 
edited by Michael G. Pecht. 
 - New York :  Wiley,  c1993. 
 - xiv, 296 p. :  ill. ;  25 cm. 
<br/><br/> "A Wiley-Interscience publication." 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>047159167X (alk. paper) 
<br/><br/><label>LCCN: </label>92033770  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials.<br/>Solder and soldering.<br/>Surface mount technology.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .So4 1993 
<br/><br/><label>Dewey Class. No.: </label>621.381/046