Lau, John H. <br/><br/>
Chip scale package (CSP) :  design, materials, processes, reliability, and applications / 
John H. Lau, Shi-Wei Ricky Lee. 
 - New York :  McGraw-Hill,  c1999. 
 - xxii, 564 p. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>0070383049 
<br/><br/><label>LCCN: </label>98053224  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated circuits--Design and construction.<br/>Microelectronic packaging.
<br/><br/><label>LC Class. No.: </label>TK7874  / .L36 1999 
<br/><br/><label>Dewey Class. No.: </label>621.3815