Soldering processes and equipment / edited by Michael G. Pecht.
Material type:
TextPublication details: New York : Wiley, c1993Description: xiv, 296 p. : ill. ; 25 cmISBN: 047159167X (alk. paper)Subject(s): Electronic packaging -- Materials | Solder and soldering | Surface mount technologyDDC classification: 621.381/046 LOC classification: TK7870.15 | .So4 1993Online resources: Publisher description | Table of Contents
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
ATU Book
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SCHOOL OF APPLIED SCIENCE & ENGINEERING LIBRARY - ACCRA TECHNICAL UNIVERSITY General Stacks | TK7870.15 .So4 1993 (Browse shelf(Opens below)) | c1 | Available | 0000009058 | ||
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ATU Book
|
SCHOOL OF APPLIED SCIENCE & ENGINEERING LIBRARY - ACCRA TECHNICAL UNIVERSITY General Stacks | TK7870.15 .So4 1993 (Browse shelf(Opens below)) | c2 | Available | 0000009059 |
Total holds: 0
Browsing SCHOOL OF APPLIED SCIENCE & ENGINEERING LIBRARY - ACCRA TECHNICAL UNIVERSITY shelves, Shelving location: General Stacks Close shelf browser (Hides shelf browser)
| TK7870.15 .Ar3 2002 Area array packaging materials | TK7870.15 .Ar3 2002 Area array packaging materials | TK7870 .15Ar3 2004 Area Array Packaging Materials/ | TK7870.15 .So4 1993 Soldering processes and equipment / | TK7870.15 .So4 1993 Soldering processes and equipment / | TK7870.2 .K96 2000 Troubleshooting and Maintenance of Electronic Equipment/ | TK7870.2 .K96 2001 Troubleshooting and Maintenance of Electronic Equipment/ |
"A Wiley-Interscience publication."
Includes bibliographical references and index.
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