Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.
Material type:
TextPublication details: New York : McGraw-Hill, c1999Description: xxii, 564 p. : ill. ; 24 cmISBN: 0070383049Subject(s): Integrated circuits -- Design and construction | Microelectronic packagingDDC classification: 621.3815 LOC classification: TK7874 | .L36 1999Online resources: Table of contents only | Contributor biographical information | Publisher description
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
ATU Book
|
SCHOOL OF APPLIED SCIENCE & ENGINEERING LIBRARY - ACCRA TECHNICAL UNIVERSITY General Stacks | TK7874 .L36 1999 (Browse shelf(Opens below)) | c1 | Available | 0000008758 |
Total holds: 0
Browsing SCHOOL OF APPLIED SCIENCE & ENGINEERING LIBRARY - ACCRA TECHNICAL UNIVERSITY shelves, Shelving location: General Stacks Close shelf browser (Hides shelf browser)
| TK7874 .J17 2003 Microelectronic circuit design / | TK7874 .J17 2003 Microelectronic circuit design / | TK7874 .J62 1997 Analog integrated circuit design / | TK7874 .L36 1999 Chip scale package (CSP) : design, materials, processes, reliability, and applications / | TK7874 .M65 1987 Microelectronics/ | TK7874 .N25 2007 Microelectronics: Circuit Analysis and Design/ | TK7874 .P32 1991 Troubleshooting Analog Circuits/ |
Includes bibliographical references and index.
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